Xiao Wang

Zhengzhou University of Light Industry

China

  • Zhengzhou University of Light Industry

SCHOLARLY PAPERS

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Scholarly Papers (1)

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Enhance Mechanical Property and Electrical Conductivity Simultaneously of Sn-Cu-Co Solder Alloys by Directional Solidification

Number of pages: 33 Posted: 28 Nov 2023
Jianglei Fan, Jiaojiao Wang, Xiao Wang, Zhanyun Liu, Shen Wu, Yan Wang, Ying Li, Zhou Xiangkui and Shizhong Wei
Zhengzhou University of Light Industry, Zhengzhou University of Light Industry, Zhengzhou University of Light Industry, Zhengzhou University of Light Industry, Zhengzhou University of Light Industry, Zhengzhou University of Light Industry, Zhengzhou University of Light Industry, Zhengzhou University of Light Industry and Henan University of Science and Technology
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Abstract:

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Sn-Cu solder alloy, Solidification parameters, Conductivity, microstructure evolution, Hardness