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lipeng yan

Henan Institute of Technology

China

SCHOLARLY PAPERS

3

DOWNLOADS

40

TOTAL CITATIONS

0

Scholarly Papers (3)

1.

Research on the Room Temperature and High-Temperature Mechanical Properties and Microstructure of Hot Extruded Mg-Gd-Y-Sm-Zr Alloys

Number of pages: 17 Posted: 05 Dec 2023
ruitao cheng, lipeng yan, xiaoke li and Zhen Feng
Henan Institute of Technology, Henan Institute of Technology, Zhengzhou University of Light Industry and Henan Institute of Science and Technology
Downloads 15 (1,500,778)

Abstract:

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magnesium alloy, elevated temperature tensile, grain boundary strengthening, nano precipitate zone, Phase transformation

Distribution Characteristics of Interfacial Reaction Layer and its Effect in Ti/Q235 Joint

Number of pages: 36 Posted: 21 Aug 2025
Henan University of Science and Technology, Henan University of Science and Technology, Henan University of Science and Technology, Henan Institute of Technology, Henan University of Science and Technology and Henan University of Science and Technology
Downloads 8 (1,621,812)

Abstract:

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Reaction Layer, interface, property, microstructure

Distribution Characteristics of Interfacial Reaction Layer and its Effect in Ti/Q235 Joint

Number of pages: 36 Posted: 13 Aug 2025
Henan University of Science and Technology, Henan University of Science and Technology, Henan University of Science and Technology, Henan Institute of Technology, Henan University of Science and Technology and Henan University of Science and Technology
Downloads 5 (1,640,921)

Abstract:

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Reaction layer, Interface, Property, Microstructure

3.

Microstructure and Properties of Joint of Al/Cu Welded by Resistance Element Welding with an Auxiliary Gasket of Ni

Number of pages: 22 Posted: 03 Aug 2024
Henan University of Science and Technology, Henan University of Science and Technology, Henan University of Science and Technology, Henan University of Science and Technology and Henan Institute of Technology
Downloads 12 (1,526,714)

Abstract:

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Resistance element welding, aluminum, copper, microstructure, performance