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Yan Niu

Tiangong University

China

  • Tiangong University

SCHOLARLY PAPERS

2

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71

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0

Scholarly Papers (2)

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1.

Interfacial Stress Analyses of the Three Parameter Elastic Foundation Model for Mini-Led Chip-Uv Film Adhesive Structure and its Crack Propagation Experimental Study

Number of pages: 43 Posted: 08 Feb 2024
Li Ma, Yanhui Chen, Yun Chen, Maoxiang Hou, Xin Chen, Ching-Ping Wong, Yan Niu and Minghui Yao
Guangdong University of Technology, Guangdong University of Technology, Guangdong University of Technology, Guangdong University of Technology, Guangdong University of Technology, Georgia Institute of Technology - School of Materials Science and Engineering, Tiangong University and Tiangong University
Downloads 45 (1,121,190)

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adhesive structure, scale effect, interface stress, interface debonding, crack propagation

2.

Vibration and Probability Investigation of the Hard-Coated Mistuned Blisk with Multi-Packets

Number of pages: 28 Posted: 15 Jul 2025
Bin Bai, Wei Zhang, Minghui Yao, Yan Niu and Qi liang Wu
affiliation not provided to SSRN, Guangxi University, Tiangong University, Tiangong University and Tiangong University
Downloads 26 (1,399,036)

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Hard-coated mistuned blisk with multi-packets, Lumped parameter model, Vibration reduction, Modal characteristics, Probability distribution