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Mingwei Chen

affiliation not provided to SSRN

SCHOLARLY PAPERS

1

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37

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0

Scholarly Papers (1)

1.

Electrodeposition, Microstructure and Characterization of High Tensile and Low Surface Copper Foil by Polyethylene Glycol Addtives

Number of pages: 7 Posted: 15 Feb 2024
Jiangxi University of Science and Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 37 (1,236,159)

Abstract:

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Electrolytic copper foil, Additive, tensile strength, Electrodeposition model