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Dongdong Zhu

Changchun Institute of Technology

China

  • Changchun Institute of Technology

SCHOLARLY PAPERS

2

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43

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0

Scholarly Papers (2)

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1.

The Microporous Channel Copper Immersion Layer Promotes the Rapid Ni-P Electroless Plating Process of Aluminum Alloys at Medium and Low Temperatures

Number of pages: 24 Posted: 17 Apr 2024
Dongdong Zhu, Qinghui Wang, Jiale Sun, Xijia Yang, Liying Wang and Xuesong Li
Changchun Institute of Technology, Changchun University of Technology, Changchun University of Technology, Changchun University of Technology, Changchun University of Technology and Changchun University of Technology
Downloads 26 (1,385,945)

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Copper activation, Accelerator, aluminum alloys, Electroless Ni-P, Medium-low temperature

2.

Study on Surface Oxidation Pretreatment and Mechanism of Carbon Fiber at High Temperature

Number of pages: 8 Posted: 25 May 2024
Qinghui Wang, Xuesong Li, Dongdong Zhu and Jiale Sun
Changchun University of Technology, Changchun University of Technology, Changchun Institute of Technology and Changchun University of Technology
Downloads 17 (1,481,165)

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Carbon materials, XPS, FTIR, Thermal analysis