affiliation not provided to SSRN
R1233zd(E), pool boiling, Aluminum, Micro-pin finned surfaces, thermal management
3D thermosyphon, Data Center Cooling, Air Cooling, model prediction
Vapor chamber, Electronic chip cooling, High power, High heat flux
Vapor chamber, high-power, gradient capillary structure
Electronics cooling, Aluminum-Based Vapor Chamber, Composite Capillary Structure, R1233zd(E)
Electronics cooling, Aluminum-Based VC, Composite Capillary Structure, R1233zd(E)
Electronics Cooling, Three-dimensional thermosyphon, Boiling heat transfer enhancement, Aluminum.
Refrigerant MCLC-10, pool boiling, Thermal Management of Electronic Devices, Three-Dimensional Thermosyphon
Refrigerant MCLC-10, Pool Boiling, Thermal Management of Electronic Devices, Three-Dimensional Thermosyphon
Pool boiling, Microstructured surface, Critical heat flux, Heat transfer coefficient, R1233zd(E)
