hongwei niu

Jiangsu University of Technology

China

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Microstructure Evolution and Growth Kinetics of Cu6sn5 Intermetallic Compound at Liquid-Solid Interfaces in Cu/Sn/Cu Interconnects Under Ultrasonic Waves

Number of pages: 15 Posted: 22 May 2024

hongwei niu, Hong Bian, Jian Wang, X.G. Song and H.Y. Zhao

Jiangsu University of Technology, Harbin Institute of Technology, Jiangsu University of Technology, Harbin Institute of Technology and Harbin Institute of Technology

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