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Meng Xue

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

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36

TOTAL CITATIONS

0

Scholarly Papers (2)

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1.

Polystyrene Shell-Based "Coconut-Like" and "Pomegranate-Like" Microencapsulated Phase Change Materials: Formation Mechanism, Thermal Conductivity/Stability Enhancement and Their Application in Thermal Management

Number of pages: 36 Posted: 18 Jul 2024
Wei Zhang, Rui Pan, Jihua Yang, Mengru Liu, Yunle Yao, Awang Zhang, Yi Gong, Zhengya Gan, Rui Hu, Jianjun Ding, Lin Chen, Xian Zhang, Meng Xue and Xingyou Tian
University of Science and Technology of China (USTC), University of Science and Technology of China (USTC), University of Science and Technology of China (USTC), University of Science and Technology of China (USTC), University of Science and Technology of China (USTC), Anhui University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 20 (1,448,301)

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Microencapsulated phase change materials, Polystyrene, Formation mechanism, Thermal conductivity, Thermal stability, thermal management

2.

Preparation of Highly Thermally Conductive Polyimide Film with Hexagonal Alumina Flakes

Number of pages: 22 Posted: 22 Oct 2024
Yuan Niu, Chao Xiao, Mengyue Hu, Xianglan Liu, Xin Ding, Meng Xue, Xingyou Tian, Kang Zheng and Xian Zhang
Hefei University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 16 (1,500,778)

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Hexagonal alumina, PI, Out of plane thermal conductivity