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Xiaobo Peng

Yanshan University

School of Information Science and Engineering

Qinhuangdao

China

  • Yanshan University

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Brittle-ductile transition mechanism in grinding of 4H-SiC wafer considering laminated structure

Number of pages: 34 Posted: 26 Jun 2024
Meina Qu, Chuanzhen Huang, Shuiquan Huang, Xiaobo Peng, Zhen Wang, Longhua Xu, Zhengkai Xu, Dijia Zhang and Baosu Guo
Yanshan University, Yanshan University, Yanshan University, Yanshan University, Yanshan University, Yanshan University, Yanshan University, Yanshan University and Yanshan University
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grindingbrittle-ductile transition mechanisminterval estimationlaminated material4H-SiC wafer with alloy backside layer