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Krishna Kamlesh Verma

University of North Texas

1155 Union Circle #305340

Denton, TX 76203

United States

Indian Institute of Science (IISc) - Department of Materials Engineering

  • University of North Texas

SCHOLARLY PAPERS

2

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200

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Scholarly Papers (2)

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1.

Exploring Microcrack Formation in Cyclic and Dwell Fatigue in MTR-lean Ti 6242 Alloy

Number of pages: 29 Posted: 09 Jul 2024
Tirthesh Ingale, Mainak Sen, Krishna Kamlesh Verma, Akshat Godha, Tejanath Reddy Sureddy, Shanoob Balachandran, Satyam Suwas, Vasisht Venkatesh and Dipankar Banerjee
University of North Texas, Indian Institute of Science (IISc) - Department of Materials Engineering, University of North Texas, Indian Institute of Science (IISc) - Department of Materials Engineering, Indian Institute of Science (IISc) - Department of Materials Engineering, Alloyed Ltd., Indian Institute of Science (IISc) - Department of Materials Engineering, Pratt & Whitney Aircraft and Indian Institute of Science (IISc) - Department of Materials Engineering
Downloads 134 (547,695)

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Titanium alloys, dwell fatigue, microcrack formation, deformation structure

2.

Thermal Treatment Induced Nano-Scale Spinodal Decomposition for Enhanced Hard Magnetic Properties in Laser Additively Fabricated Alnico with Blended Elemental Powder Precursor

Number of pages: 16 Posted: 30 Oct 2024
Saikumar Dussa, Sudip Kumar Sarkar, Krishna Kamlesh Verma, Sameehan S. Joshi, Madhavan Radhakrishnan, Shashank Sharma, Rajarshi Banerjee and Narendra B. Dahotre
University of North Texas, Bhabha Atomic Research Centre - Materials Science Division, University of North Texas, University of North Texas, University of North Texas - Department of Materials Science and Engineering, University of North Texas, University of North Texas - Department of Materials Science and Engineering and University of North Texas - Department of Materials Science and Engineering
Downloads 66 (924,743)

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Alnico permanent magnet, Laser-directed energy deposition (LDED), Spinodal decomposition, Atom probe tomography, Transmission electron microscopy.