Hwasung Lee

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SCHOLARLY PAPERS

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Scholarly Papers (1)

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High-Efficiency Heat Dissipation Coating Implemented with Stepwise Thermally Conductive Pathway Using Polymer-Nanocoated Thermal Filler

Number of pages: 24 Posted: 10 Jul 2024
Jisu Park, Dashdendev Tsogbayar, Minseob Lim, Taehoon Hwang, Jungyoon Seo, Eun Ko, Yumin Kim, Siyoung Lee, Yong-Ho Choa and Hwasung Lee
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, University of Pennsylvania, Hanyang University and affiliation not provided to SSRN
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Abstract:

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heat dissipation, thermally conductive paste, thermally conductive film, Parylene nanocoating, thermal conductivity