Xiaoxuan Li

affiliation not provided to SSRN

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SCHOLARLY PAPERS

2

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25

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Scholarly Papers (2)

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1.

High-Quality Wafer Level 3-Inch Inp/Sio2/Si Hetero-Bonding for Advancing Optoelectronic Integrations

Number of pages: 23 Posted: 31 Dec 2024
Ruyan Kang, Zehan Liu, Jian Zhou, Xiaoshan Wang, Xueyi Duan, Xiaoxuan Li, Jia Zhao and Zhiyuan Zuo
Shandong University, Shandong University, Shandong University, Shandong University, affiliation not provided to SSRN, affiliation not provided to SSRN, Shandong University and Shandong University
Downloads 19 (1,161,040)

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Optoelectronic integration, Low-temperature bonding, HRTEM, Crystal defect, Residual interface stress

2.

[[Equation]] High-Quality Wafer Level 3-Inch Inp/Sio2/Si Hetero-Bonding for Advancing Optoelectronic Integrations

Number of pages: 18 Posted: 06 Aug 2024
Ruyan Kang, Zehan Liu, Jian Zhou, Xiaoshan Wang, Xueyi Duan, Xiaoxuan Li, Jia Zhao and Zhiyuan Zuo
Shandong University, Shandong University, Shandong University, Shandong University, affiliation not provided to SSRN, affiliation not provided to SSRN, Shandong University and Shandong University
Downloads 6 (1,296,727)

Abstract:

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Optoelectronic integration, Low-temperature bonding, HRTEM, Residual interface stress, Heterogeneous LD chip