Yuhang Liu

Beijing University of Technology

100 Ping Le Yuan

Chaoyang District

Beijing, 100020

China

SCHOLARLY PAPERS

1

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0

Scholarly Papers (1)

1.

Thermal Simulation Study of Forging During Solidification of Al-Cu Alloys

Number of pages: 24 Posted: 21 Aug 2024
Beijing University of Technology, Beijing University of Technology, Beijing University of Technology, CHINALCO Research Institute of Science and Technology, Beijing University of Technology, Beijing University of Technology, Beijing University of Technology, Beijing University of Technology, Beijing University of Technology, Beijing University of Technology, College of Materials Science and Engineering, Education Ministry of China, Key Laboratory of Advanced Functional Materials and Beijing University of Technology
Downloads 9 (1,289,737)

Abstract:

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Gleeble thermal simulation, solidification, forging, solid-phase fraction, dendrites, defect