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Tianjian Liu

affiliation not provided to SSRN

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Scholarly Papers (1)

1.

Numerical Simulation of Novel Stepped Hybrid Bonding Interface Using Finite Element Analysis

Number of pages: 11 Posted: 21 Aug 2024
Wuhan University, Wuhan University, Huazhong University of Science and Technology, affiliation not provided to SSRN, Wuhan University, Wuhan University and Wuhan University
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Abstract:

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advanced packaginghybrid bondingnumerical simulationstepped bonding interfacesemiconductor