Shuai-peng Chen

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Preparation and Properties of Cu6sn5 Intermetallic-Bonded Diamond Grinding Wheel for Thinning Sic Wafer

Number of pages: 23 Posted: 31 Aug 2024
Shuai-peng Chen, Hao Li, Xiyue Kang, Yao Jiang, Wenbo Ma, Xiao-can Yan and Yue-hui He
affiliation not provided to SSRN, affiliation not provided to SSRN, Central South University, affiliation not provided to SSRN, Xiangtan University, affiliation not provided to SSRN and affiliation not provided to SSRN
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Cu6Sn5 intermetallics, SiC wafer, diamond grinding wheel, surface ceramization, grinding performance