Duy Le Han

Hanoi University of Science and Technology

Vietnam

  • Hanoi University of Science and Technology

SCHOLARLY PAPERS

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Scholarly Papers (1)

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Properties of In-Sn-Xcu Alloys and Their Joints on a Cu Substrate Before and after Isothermal Aging

Number of pages: 36 Posted: 06 Sep 2024
Duy Le Han, Hanh Bui Van, Nguyen Van Anh, Trinh Quang Ngoc and Hiroshi Nishikawa
Hanoi University of Science and Technology, Hanoi University of Science and Technology, affiliation not provided to SSRN, Hanoi University of Science and Technology and The University of Osaka - Joining and Welding Research Institute
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Abstract:

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SnInCu Alloys, Thermal Aging, Microstructural Transformation, Flexible Electronics, Intermetallic Compounds (IMCs)