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Masaomi Shimura

FINECS Co., Ltd.

SCHOLARLY PAPERS

1

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62

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0

Scholarly Papers (1)

1.

Study on Changes in Intermetallic Compounds and Whisker Formation Over Time in Sn/Cu Plating

Number of pages: 18 Posted: 11 Sep 2024
Toyama College, University of Toyama, University of Toyama, FINECS Co., Ltd. and FINECS Co., Ltd.
Downloads 62 (951,658)

Abstract:

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Sn/Cu plating, Intermetallic compounds, whiskers, Cu plating thickness, Sn plating crystal grain size, Reaction Kinetics