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Jason Cong

University of California, Los Angeles (UCLA)

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Investigating the Effects of Fine-Grain Three-Dimensional Integration on Microarchitecture Design

ACM Journal on Emerging Technologies in Computing Systems, Vol. 4, No. 4, Article 17, October 2008
Posted: 02 Oct 2024
Yuchun Ma, Yongxiang Liu, Eren Kurshan, Glenn Reinman and Jason Cong
Tsinghua University, University of California, Los Angeles (UCLA), Princeton University, University of California, Los Angeles (UCLA) and University of California, Los Angeles (UCLA)

Abstract:

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B.7.0 [Integrated Circuits]: General, C.1.0 [Processor Architectures]: General Design, Performance 3D integration, thermal, microarchitecture, 3D packing