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Zeyu Zhao

Chongqing University of Posts and Telecommunications

Nan’an District

Chongqing, 400065

China

  • Chongqing University of Posts and Telecommunications

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Scholarly Papers (1)

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Integrated Design of Cooling Channel Structure and Functionality for 3d Chips

Number of pages: 100 Posted: 08 Oct 2024
Xi Zhao, Zeyu Zhao, Sheng Lu, Yang Zhao, Ying Ma and Mingdong Zhou
Chongqing University of Posts and Telecommunications, Chongqing University of Posts and Telecommunications, Chongqing University of Posts and Telecommunications, Chongqing University of Posts and Telecommunications, Chongqing University of Posts and Telecommunications - Institute of Advanced Manufacturing Engineering and affiliation not provided to SSRN
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Abstract:

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3D chip and Through-silicon vias and Cooling channels and Topology optimization and Feature-based method