Chaoshu Fu

Kunming University of Science and Technology

Kunming Yunnan China

Kunming

China

  • Kunming University of Science and Technology

SCHOLARLY PAPERS

1

DOWNLOADS

24

TOTAL CITATIONS

0

Scholarly Papers (1)

Actions:
Email selected abstracts
1.

Simulation and Analysis of Material Stacking and Migration Induced by Extrusion Behavior in 3dpc

Number of pages: 47 Posted: 08 Oct 2024
Ziqi Zhang, Tinghong Pan, Rongxin Guo, Run-Sheng Lin, Chaoshu Fu, Zhiqiang Luo, Dian Guan and Xiang Li
Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology and Kunming University of Science and Technology
Downloads 24 (1,108,278)

Abstract:

Loading...

CFD, 3DPC, Squeeze induced, Material migration, Path difference