Storrs, CT 06269-1063
United States
University of Connecticut
Soft encapsulation materials, Thermal management, Polyisobutylene (PIB), Hexagonal boron nitride (hBN), Diffusion barriers, Electrochemical stability
Pitting corrosion, Thin film microelectrodes, Electrochemical polarization, Peridynamic modeling, Localized dissolution, Moving boundary modeling
Nanoflakes, montmorillonite, filler and matrix, thin films on substrates, peridynamics, fragmentation behavior