Zijie Huang

Tsinghua University

Beijing, 100084

China

  • Tsinghua University

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Scholarly Papers (1)

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Joining Copper to Thermosetting Polymer Via “Mortise and Tenon” Interlocking and Chemical-Bonding Both In-Situ Generated During Friction Stir Spot Welding

Number of pages: 39 Posted: 16 Oct 2024
Wu yidi, Jiaxun Li, Zijie Huang, Fangzheng Shi, Licheng Sun, Huihong Liu, Gaoqiang Chen, Peng Li, Yongbing Li and Zhongqin Lin
affiliation not provided to SSRN, affiliation not provided to SSRN, Tsinghua University, Tsinghua University, affiliation not provided to SSRN, affiliation not provided to SSRN, Tsinghua University, affiliation not provided to SSRN, Shanghai Jiao Tong University (SJTU) - Shanghai Key Laboratory of Digital Manufacture for Thin-walled Structures and affiliation not provided to SSRN
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Thermosetting polyimide, Copper, "mortise and tenon" interlocking, chemical bonding