Hongjun Ding

Kunming University of Science and Technology

Kunming Yunnan China

Kunming

China

  • Kunming University of Science and Technology

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Scholarly Papers (1)

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Behavior of Tellurium During Vacuum Thermal Decomposition Of Ag-Cu-Te Alloy

Number of pages: 23 Posted: 18 Oct 2024
Jia Deng, Hongjun Ding, Huan LUO, Baoqiang Xu, Xianjun Lei and Bin Yang
Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology, Kunming University of Science and Technology and Kunming University of Science and Technology
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Abstract:

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Ag-Cu-Te alloy, Vacuum, Thermal decomposition, Tellurium, Molecular dynamics