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Hui Jiang

Chongqing University

Shazheng Str 174, Shapingba District

Shazheng street, Shapingba district

Chongqing 400044, 400030

China

SCHOLARLY PAPERS

1

DOWNLOADS

19

TOTAL CITATIONS

0

Scholarly Papers (1)

1.

Effects of Copper Powder Size and Content on Tin Penetration and Joint Porosity in Soldering: A Molecular Dynamics and Experimental Study

Number of pages: 26 Posted: 19 Nov 2024
Hanbing Li, Hui Jiang and Jun Shen
Chongqing University, Chongqing University and Chongqing University, College of Material Science and Engineering, State Key Laboratory of Mechanical Transmission
Downloads 19 (1,459,862)

Abstract:

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Cu powder content, Cu powder particles size, Molecular dynamics, Porosity