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Ken Mukai

affiliation not provided to SSRN

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Copper-Formate Seeding for Scalable High Electrical Conductivity Copper-Carbon Nanotube Wires

Number of pages: 25 Posted: 20 Dec 2024
Yuichi Kato, Masahiro Yamamura, Hideo Tokuhisa, Rajyashree M. Sundaram, Atsuko Sekiguchi, Ken Mukai, Takushi Sugino and Ken Kokubo
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
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Abstract:

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metal-carbon composite, electroless plating, electro plating, single-walled carbon nanotube, conductive wire