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Wen-Bai Liu

Northeastern University (USA)

220 B RP

Boston, MA 02115

United States

  • Northeastern University (USA)

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Scholarly Papers (1)

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A Novel Model for the Removal and Capture of Inclusions in Electroslag Remelting Process

Number of pages: 28 Posted: 08 Jan 2025
Hong-Chun Zhu, Zhuowen Ni, Hua-Bing Li, Zhi-Yu He, Wen-Bai Liu, ZhouHua Jiang, Hao Feng and Shucai Zhang
Northeastern University (USA), Northeastern University (USA), Northeastern University (USA), Northeastern University (USA), Northeastern University (USA), Northeastern University (USA), Northeastern University (USA) and Northeastern University (USA)
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Abstract:

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Electroslag remelting, inclusion removal, Heat transfer, electromagnetism