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Herui Liu
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SCHOLARLY PAPERS
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Scholarly Papers (1)
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1.
Adhesion of Ferroelectric Cuinp2s6 on Various Substrates Measured by a Blister Test
Number of pages: 14
Posted: 28 Jan 2025
Herui Liu,
Tingjun Wang
,
Yichong Chen
,
Wenchen Zhu
,
Zuolong Jia
,
Jiawang Hong
,
Yuanyuan Cui
and
Xueyun Wang
affiliation not provided to SSRN
, Beijing Institute of Technology, Beijing Institute of Technology,
affiliation not provided to SSRN
,
affiliation not provided to SSRN
, Beijing Institute of Technology, Beijing Institute of Technology and Beijing University of Technology
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Abstract:
CuInP2S6, interface, blister test, Adhesion Energy
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