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Chenghao Zhang

Harbin University of Science and Technology

52 Xuefu Rd

Nangang

Harbin, 150080

China

  • Harbin University of Science and Technology

SCHOLARLY PAPERS

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Scholarly Papers (1)

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Research on the Interface Structure Composite Behavior and Performance Influence of Ni and Cr Elements in Sn-Cu-Bi-In Solder Microstructure

Number of pages: 43 Posted: 31 Jan 2025
Xiaochun Lv, Zhiyuan Wang, Zhen Pan, Chenghao Zhang, Zhiyuan Wang, Fenglian Sun and Yang Liu
Harbin University of Science and Technology, Harbin University of Science and Technology, Harbin University of Science and Technology, Harbin University of Science and Technology, Harbin Institute of Technology, Harbin University of Science and Technology and Harbin University of Science and Technology
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Abstract:

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Electronic packaging materials, solder alloy, Sn-Cu-Bi-In, Intermetallic compound, Mechanical properties