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Xvdong Hou

affiliation not provided to SSRN

SCHOLARLY PAPERS

1

DOWNLOADS

49

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0

Scholarly Papers (1)

1.

Wetting Study of in and Sn Solders on Alsc Target and Cu Backboard Materials Based on Molecular Dynamics and First-Principles Calculation

Number of pages: 23 Posted: 12 Feb 2025
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Zhengzhou University, Zhengzhou University, Zhengzhou University, Zhengzhou University, Zhengzhou University and Zhengzhou University
Downloads 49 (1,074,648)

Abstract:

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Solder, Molecular dynamics simulation, Wettability, Spreading mechanism, Interface effect