default author photo

André Schwöbel

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

1

DOWNLOADS

34

TOTAL CITATIONS

0

Scholarly Papers (1)

Actions:
Email selected abstracts
1.

Enhancing Silver Sintering - Effect of Copper Substrate Microstructure on Silver Adhesion and Bond Strength

Number of pages: 39 Posted: 18 Feb 2025
Tamira Stegmann, Karsten Durst, Enrico Bruder, Stefan Gunst and André Schwöbel
affiliation not provided to SSRN, Technical University of Darmstadt - Division of Physical Metallurgy, Technical University of Darmstadt - Division of Physical Metallurgy, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 34

Abstract:

Loading...

Power Electronics, silver sintering, Grain orientation, Microstructure, Adhesion