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Chengqi Wang

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SCHOLARLY PAPERS

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Scholarly Papers (1)

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Experimental Study and Constitutive Analysis of Compressive Creep Behavior of Solder Material in Igbt Modules

Number of pages: 22 Posted: 13 Apr 2025
Shaoqing Liu, Yuda Cao, Li Chen, Xiaobin He, Chengqi Wang, Yangxuan Su and Lingjun Wang
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
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Solder alloy, Compressive creep, Creep damage, Creep law, Low temperature alloy