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Zekai Liu

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

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Scholarly Papers (1)

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Optimized Immersion Boiling-Based Thermal Management of Heterogeneous Three-Dimensional Integrated Circuits

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Optimized Immersion Boiling-Based Thermal Management of Heterogeneous Three-Dimensional Integrated Circuits

Number of pages: 57 Posted: 07 May 2025
Bingcheng Li, Xingbao An, Zekai Liu, Min Zeng and Qiuwang Wang
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and Xi'an Jiaotong University (XJTU)
Downloads 23 (1,459,262)

Abstract:

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Microstructure simplification, Immersion boiling cooling, Micro bump height, 3D integrated circuits (3DICs), Non-uniform heat source distribution, Computational efficiency

Optimized Immersion Boiling-Based Thermal Management of Heterogeneous Three-Dimensional Integrated Circuits

Number of pages: 39 Posted: 16 Jun 2025
Bingcheng Li, Xingbao An, Zekai Liu, Min Zeng and Qiuwang Wang
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and Xi'an Jiaotong University (XJTU)
Downloads 10 (1,606,395)

Abstract:

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Immersion boiling cooling, Heat and mass transfer, Micro bump height, 3D integrated circuits (3DICs), Non-uniform heat source distribution, Computational efficiency