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Zunyu GUAN

affiliation not provided to SSRN

  • affiliation not provided to SSRN

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Bubble Dynamics in Microfluidic Electroless Copper Interconnection for Advanced 3d Chip Integration

Number of pages: 26 Posted: 16 May 2025
Yonglin ZHANG, Yuzi HAN, Peilun YAO, Zunyu GUAN, Haibin CHEN and Jinglei Yang
Hong Kong University of Science & Technology (HKUST), Hong Kong University of Science & Technology (HKUST), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and Hong Kong University of Science & Technology (HKUST)
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Chip 3D integration, Microfluidic electroless interconnection, hydrogen bubble dynamics, force balance model, phase field model, retention effect