Wentao Huang

Harbin Institute of Technology

92 West Dazhi Street

Nan Gang District

Harbin, 150001

China

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Thermo-Compression Collective Bonding Using Pressure Compensation Strategy for 3d Packaging Cu/Sn Bonding

Number of pages: 28 Posted: 23 May 2025

Bin Zhou, Jianxin Qiao, Wentao Huang and Longqiu Li

Harbin Institute of Technology, Harbin Institute of Technology, Harbin Institute of Technology and Harbin Institute of Technology

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