Wei Sun

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Thermoelectric Coupling Model for Cemented Tailings Backfill Based on Microwave Curing

Number of pages: 27 Posted: 27 May 2025

Wei Sun, Jiangnan Luo, Di Wu, Weiyang Shen, Jie Liu, Xueming Fang and Faqing Qin

affiliation not provided to SSRN, affiliation not provided to SSRN, University of Science and Technology Beijing, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN

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