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Wanqun Chen

affiliation not provided to SSRN

  • affiliation not provided to SSRN

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Laser-Assisted Mini-Led Bonding with Simulation-Drived Parameters: Enhanced Joint Reliability Over Conventional Reflow Process

Number of pages: 12 Posted: 30 May 2025
Li Ma, Shijun Wu, Yun Chen, Xiangyun Luo, Chunhao Qin, Wanqun Chen, Xin Chen and Maoxiang Hou
Guangdong University of Technology, Guangdong University of Technology, Guangdong University of Technology, Guangdong University of Technology, Guangdong University of Technology, affiliation not provided to SSRN, Guangdong University of Technology and Guangdong University of Technology
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Laser-assisted bonding, Mini-LED chips, thermodynamic simulation, shear experiment, solder joint reliability