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Jingzhu Pang

Donghua University

Shanghai 200051

China

  • Donghua University

SCHOLARLY PAPERS

2

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55

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Scholarly Papers (2)

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1.

Research on the Material Removal Mechanism in Laser-Grooving-Assisted Dicing of Monocrystalline Silicon

Number of pages: 27 Posted: 09 Aug 2025
Zikang Fu, Jingzhu Pang, Xiaomin Liu and Chongjun Wu
Donghua University, Donghua University, Donghua University and Donghua University
Downloads 36 (1,304,549)

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Monocrystalline Silicon, Laser-Grooving-Assisted Dicing, Indentation and Scratching, Fracture Toughness, Material Removal Mechanism

2.

Investigations on the Material Removal And Damage Formation Mechanisms of Wc-Co Cemented Carbide in Hybrid Laser Softening and Single-Grain Scratching Process

Number of pages: 43 Posted: 01 Jul 2025
Shibo Li, Chongjun Wu, Lingwen Chen, Jingzhu Pang, Yaqin Zhou and Steven Liang
Donghua University, Donghua University, Donghua University, Donghua University, Donghua University and Georgia Institute of Technology - George W. Woodruff School of Mechanical Engineering
Downloads 19 (1,470,786)

Abstract:

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Laser-assisted scratching, Grinding mechanism, Cemented carbide, Scratching force