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Hongsheng Xu

Henan University of Technology

China

  • Henan University of Technology

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Scholarly Papers (1)

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Microstructural Evolution and Mechanical Properties of Chip-Stacking Micro-Solder Joints Under Tg Bonding Process

Number of pages: 20 Posted: 04 Jul 2025
Ye Tian, Hongsheng Xu, Yuejun Li, Zhongyu Liu, Daoming Fan, Chao Wang, Zhiqiang Li, Wei Liu, Xing Chen and Fengshun Wu
Henan University of Technology, Henan University of Technology, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Henan University of Technology and Huazhong University of Science and Technology
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3D Chip-Stacking, Thermal Gradient Bonding, Micro-Solder Joint, Mechanical property