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tongjian Liu

Northeastern University (USA)

220 B RP

Boston, MA 02115

United States

  • Northeastern University (USA)

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Research of Thermal Management Optimization for Sic Power Modules Utilizing Thermoelectric Coolers

Number of pages: 26 Posted: 05 Jul 2025
tongjian Liu, Jiajun Yang, Yang Zhao, Zhi Yu, Xiaoshuang Hui, Dongrun Li, Yuhui Kang, Kaiping Tai, Puqi Ning, Xin Yan and DongMing Sun
Northeastern University (USA), affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Northeastern University (USA) and affiliation not provided to SSRN
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Keywords: SiC Power Devices, Thermoelectric Cooler (TEC), Power Module Thermal Management