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Peng Liu

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

2

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45

TOTAL CITATIONS

0

Scholarly Papers (2)

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1.

Thermohydraulic and Thermal Stress Characteristics in Gyroid Tpms Heat Sinks for the Cooling of Chips with Large-Area and Randomly Distributed Hotspots

Number of pages: 30 Posted: 11 Jul 2025
Xiao Cheng, Shien Zhan, Chunfu Xi, Yuheng Ma, Peng Liu and Jianjun Zhao
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 31 (1,332,057)

Abstract:

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Large-area chip cooling, Triply periodic minimal surface (TPMS), Random hotspots, Material, Thermal stress, Numerical simulation.

2.

Unveiling the Flow Boiling Heat Transfer Characteristics in a Single High-Aspect-Ratio Microchannel with Different Wettabilities

Number of pages: 33 Posted: 08 Aug 2025
Xiao Cheng, Shanshan Pan, Liu Liu, Yuheng Ma, Haojie Huang, Peng Liu and Jianjun Zhao
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 14 (1,518,554)

Abstract:

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microchannel, High-aspect-ratio, Superhydrophilic/superhydrophobic, Flow boiling, Heat Transfer