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Andriy Yakymovych

Vienna University of Technology

  • Vienna University of Technology

SCHOLARLY PAPERS

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Scholarly Papers (1)

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Influence of Fe-Nanoparticle Doped Flux on Electromigration Effects in Sac305 Solder Joints

Number of pages: 25 Posted: 22 Jul 2025
I. Wodak, Balázs Illés, Olivér Krammer, Zoltán Tafferner, Golta Khatibi, Attila Géczy, Andriy Yakymovych and Paweł Michałowski
Vienna University of Technology, Budapest University of Technology and Economics, Budapest University of Technology and Economics, Budapest University of Technology and Economics, Vienna University of Technology - Institute of Chemical Technologies and Analytics, Budapest University of Technology and Economics, Vienna University of Technology and affiliation not provided to SSRN
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Abstract:

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Electromigration, Chip-size components, Fe nanoparticles, Nanoparticle-doped flux, Hybrid solder joints