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Juan Peng

affiliation not provided to SSRN

  • affiliation not provided to SSRN

SCHOLARLY PAPERS

4

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112

TOTAL CITATIONS

0

Scholarly Papers (4)

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1.

Thermal Stress in AlN-Diamond Heterostructures: Experimental and Simulation Studies Based on Temperature-Variable Raman Spectroscopy

Number of pages: 15 Posted: 29 Sep 2025
Xiaoyu Zhang, Yan Peng, Dengke Li, Ziang Wang, Xiufei Hu, Saibin Han, Yingnan Wang, Chuanwen Song, Juan Peng and Peijian Chen
Shandong University, Shandong University, affiliation not provided to SSRN, Shandong University, Shandong University, Shandong University, Shandong University, Shandong University, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 44 (1,183,237)

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Raman spectroscopy, AlN/Dimoand, Thermally induced stress, heterostructures

2.

Investigating the Interfacial Behavior of Van Der Waals Heterostructures with Nano-Inclusions: Molecular Dynamics Simulation and Theoretical Analysis

Number of pages: 57 Posted: 31 Jul 2025
Liqun Lou, Peijian Chen, Hao Liu, Guangjian Peng and Juan Peng
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Zhejiang University of Technology - College of Mechanical Engineering and affiliation not provided to SSRN
Downloads 31 (1,345,526)

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vdW heterostructure, nano-inclusions, cohesive energy, molecular 
dynamics simulation, interfacial behavior

3.

Thermal Stress Analysis of SiC/Diamond Heterostructures Under Different Temperatures and Thicknesses: Based on Temperature-Dependent Raman Spectroscopy and Finite Element Simulation

Number of pages: 14 Posted: 05 Nov 2025
Ziang Wang, Yan Peng, Yingnan Wang, Xiufei Hu, Saibin Han, Chuanwen Song, Peijian Chen and Juan Peng
Shandong University, Shandong University, Shandong University, Shandong University, Shandong University, Shandong University, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 26 (1,411,822)

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Thermally induced stress, Raman spectroscopy, Polycrystalline diamond film, SiC, heterostructure

4.

Thermal Stress of Diamond/SiC Heterostructures: Temperature-Thickness Dependence

Number of pages: 18 Posted: 02 Jun 2026
Ziang Wang, Dengke Li, Yan Peng, Xiufei Hu, Xiaoyu Zhang, Saibin Han, Yingnan Wang, Chuanwen Song, Juan Peng and Peijian Chen
Shandong University, affiliation not provided to SSRN, Shandong University, Shandong University, Shandong University, Shandong University, Shandong University, Shandong University, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 11 (1,584,314)

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Thermally induced stress, Raman Spectroscopy, Polycrystalline diamond film, SiC, heterostructure