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Chentong Shi

affiliation not provided to SSRN

SCHOLARLY PAPERS

1

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36

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0

Scholarly Papers (1)

1.

A Novel Double-Layer Manifold Design for Uniform Cooling of Multiple Sic Power Modules

Number of pages: 28 Posted: 06 Aug 2025
affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN and affiliation not provided to SSRN
Downloads 36 (1,263,436)

Abstract:

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SiC chip cooling, Double-layer cold plate, Multiple power modules, Thermal performance evaluation