Qin Chen

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Mechanics and Thermal Behavior of Cu-Sn Solder Reinforced by Skeleton Intermetallic Compounds: Insights from Molecular Dynamics and Experiments

Number of pages: 24 Posted: 11 Aug 2025

Hanbing Li, Kaixun Shang, Jun Shen, Dengjun Luo and Qin Chen

Chongqing University, Chongqing University, Chongqing University, College of Material Science and Engineering, State Key Laboratory of Mechanical Transmission, affiliation not provided to SSRN and affiliation not provided to SSRN

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