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Jiwan Kang

University of Seoul

Seoul

Korea, Republic of (South Korea)

SCHOLARLY PAPERS

1

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21

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0

Scholarly Papers (1)

1.

Nano-Tungsten-Modified Sn–Bi Alloys for Low-Temperature, High-Reliability Microelectronic Interconnects

Number of pages: 21 Posted: 16 Sep 2025
University of Seoul, University of Seoul, University of Seoul, University of Seoul, Ajou University and University of Seoul
Downloads 21 (1,436,435)

Abstract:

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Sn-57Bi, W, solder, low temperature solder, Flexible electronics