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HaiTao Chen

affiliation not provided to SSRN

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Scholarly Papers (1)

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The effect of diamond wafer on heat transfer enhancement mechanism for the copper heat sink with high heat flux: simulation research

Number of pages: 30 Posted: 19 Sep 2025
University of Shanghai for Science and Technology, University of Shanghai for Science and Technology, affiliation not provided to SSRN, University of Shanghai for Science and Technology, University of Shanghai for Science and Technology - Shanghai Key Laboratory of Multiphase Flow and Heat Transfer in Power Engineering and Beijing Institute of Technology
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Abstract:

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Diamond-copper composite heat sink, High heat flux, Single-phase immersion cooling, Numerical simulation, Thermal resistance, temperature uniformity