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Lijie Wu

Guangdong University of Technology

No. 100 Waihuan Xi Road

Guangzhou Higher Education Mega Center

Guangzhou, 510006

China

SCHOLARLY PAPERS

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Scholarly Papers (1)

1.

Material Properties and Grinding Mechanism of SiC Laser Slicing Wafers

Number of pages: 25 Posted: 30 Sep 2025
Guangdong University of Technology, Guangdong University of Technology, Guangdong University of Technology, Guangdong University of Technology and Guangdong University of Technology
Downloads 52 (1,097,529)

Abstract:

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SiC wafers, Laser Slicing, Nano-mechanical properties, Brittle-to-plastic transition, Grinding mechanisms