default author photo

Roger H. French

Case Western Reserve University

SCHOLARLY PAPERS

1

DOWNLOADS

62

TOTAL CITATIONS

0

Scholarly Papers (1)

Actions:
Email selected abstracts
1.

Statistical Analysis and Degradation Pathway Modeling of PV Minimodules with Multiple Packaging Strategies in Indoor Accelerated Exposures

Downloads 62 (1,074,648)

Statistical Analysis and Degradation Pathway Modeling of PV Minimodules with Multiple Packaging Strategies in Indoor Accelerated Exposures

Number of pages: 24 Posted: 15 Oct 2025
Sameera Nalin Venkat, Ange Dominique Yao, Hadiza Abdulrahman Lawal, Xuanji Yu, Jiqi Liu, William C. Oltjen, Hein Htet Aung, Xinjun Li, Jean-Nicholas Jaubert, Roger H. French and Laura S. Bruckman
Case Western Reserve University, Case Western Reserve University, Case Western Reserve University, Case Western Reserve University, Case Western Reserve University, Case Western Reserve University, affiliation not provided to SSRN, affiliation not provided to SSRN, affiliation not provided to SSRN, Case Western Reserve University and Case Western Reserve University
Downloads 52 (1,095,444)

Abstract:

Loading...

Photovoltaic Module, Encapsulant, Materials characterization, Degradation Mode, Degradation Pathway Modeling.

Statistical Analysis and Degradation Pathway Modeling of PV Minimodules with Multiple Packaging Strategies in Indoor Accelerated Exposures

Number of pages: 28 Posted: 03 Jul 2026
Sameera Nalin Venkat, Ange Dominique Yao, Hadiza Abdulrahman Lawal, Xuanji Yu, Jiqi Liu, William C. Oltjen, Hein Htet Aung, Xinjun Li, Jean-Nicholas Jaubert, Roger H. French and Laura S. Bruckman
Case Western Reserve University, Case Western Reserve University, Case Western Reserve University, Case Western Reserve University, Case Western Reserve University, Case Western Reserve University, Case Western Reserve University, affiliation not provided to SSRN, affiliation not provided to SSRN, Case Western Reserve University and Case Western Reserve University
Downloads 10

Abstract:

Loading...

Photovoltaic Module, Encapsulant, Materials characterization, Degradation Mode, Degradation Pathway Modeling.