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Ziwen Lai

Shanghai University

149 Yanchang Road

SHANGDA ROAD 99

Shanghai 200072, 200444

China

  • Shanghai University

SCHOLARLY PAPERS

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Scholarly Papers (1)

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A Numerical and Machine Learning Predictive Study for Optimizing Thermal Performance in Pin-Fin Microchannel Heat Sinks

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A Numerical and Machine Learning Predictive Study for Optimizing Thermal Performance in Pin-Fin Microchannel Heat Sinks

Number of pages: 46 Posted: 24 Nov 2025
Ziwen Lai, Rui Wang, Jiahao Hou, Boxiang Wang, Shuo Zhang, Nan Shi, Shilun Feng, Jianlong Zhao and Gaozhe Cai
Shanghai University, Shanghai University, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, affiliation not provided to SSRN, Shanghai University of Traditional Chinese Medicine, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology and Shanghai University
Downloads 47 (1,119,531)

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Microchannel, Pin-fin, Hybrid heat sink, Machine Learning, Numerical simulation

A Numerical and Machine Learning Predictive Study for Optimizing Thermal Performance in Pin-Fin Microchannel Heat Sinks

Number of pages: 46 Posted: 24 Nov 2025
Ziwen Lai, Rui Wang, Jiahao Hou, Boxiang Wang, Shuo Zhang, Nan Shi, Shilun Feng, Jianlong Zhao and Gaozhe Cai
Shanghai University, Shanghai University, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, affiliation not provided to SSRN, Shanghai University of Traditional Chinese Medicine, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences (CAS) - Shanghai Institute of Microsystem and Information Technology and Shanghai University
Downloads 35 (1,281,607)

Abstract:

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Microchannel, Pin-fin, Hybrid heat sink, Machine Learning, Numerical simulation