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Beng Wah Chua

Singapore Institute of Manufacturing Technology

  • Singapore Institute of Manufacturing Technology

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Scholarly Papers (1)

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Unravelling interfacial bonding mechanism under heat treatment in hot compression bonding of heterogeneous stainless steel and mild steel

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Unravelling interfacial bonding mechanism under heat treatment in hot compression bonding of heterogeneous stainless steel and mild steel

Number of pages: 27 Posted: 04 Dec 2025
Baisong Cheng, Na Gong, Li Tian Chew, Hui Ru Tan, Fengxia Wei, Kok Heng Cheong, Gary Teh Wei Hock, Yakai Zhao, Jing Jun Lee, Ming Lin, Siew Lang Teo, Zhenjiang Li, Beng Wah Chua and Cheng Cheh Tan
Agency for Science, Technology and Research (A*STAR) - Institute of Materials Research and Engineering, Northwestern University, Agency for Science, Technology and Research (A*STAR) - Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) - Institute of Materials Research and Engineering, affiliation not provided to SSRN, Agency for Science, Technology and Research (A*STAR) - Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) - Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) - Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) - Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) - Institute of Materials Research and Engineering, Agency for Science, Technology and Research (A*STAR) - Institute of Materials Research and Engineering, Taiyuan University of Science and Technology, Singapore Institute of Manufacturing Technology and Agency for Science, Technology and Research (A*STAR) - Institute of Materials Research and Engineering
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Abstract:

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Heterogeneous Interfacial Bonding, Hot Compression Bonding, Annealing heat treatment, diffusion, Recrystallization